JPS61162054U - - Google Patents
Info
- Publication number
- JPS61162054U JPS61162054U JP4443885U JP4443885U JPS61162054U JP S61162054 U JPS61162054 U JP S61162054U JP 4443885 U JP4443885 U JP 4443885U JP 4443885 U JP4443885 U JP 4443885U JP S61162054 U JPS61162054 U JP S61162054U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adhesive sheet
- view
- utility
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4443885U JPS61162054U (en]) | 1985-03-27 | 1985-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4443885U JPS61162054U (en]) | 1985-03-27 | 1985-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61162054U true JPS61162054U (en]) | 1986-10-07 |
Family
ID=30557009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4443885U Pending JPS61162054U (en]) | 1985-03-27 | 1985-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61162054U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009029995A (ja) * | 2007-07-30 | 2009-02-12 | Sumitomo Bakelite Co Ltd | 半導体基板加工用粘着テープおよび半導体基板加工用粘着テープの製造方法、並びに半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5552233A (en) * | 1978-10-13 | 1980-04-16 | Toshiba Corp | Masking sheet |
-
1985
- 1985-03-27 JP JP4443885U patent/JPS61162054U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5552233A (en) * | 1978-10-13 | 1980-04-16 | Toshiba Corp | Masking sheet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009029995A (ja) * | 2007-07-30 | 2009-02-12 | Sumitomo Bakelite Co Ltd | 半導体基板加工用粘着テープおよび半導体基板加工用粘着テープの製造方法、並びに半導体装置の製造方法 |